Assume that a BGA assembly on a PCB is subjected to cyclic bending up to a given amplitude until the assembly ends up with an electrical 'open' (a joint fails). This is done for different amplitudes, and in each case we note the number of cycles to failure. We know ahead of time that if nothing else fails before, then the intermetallic bond in a corner joint will fail after 10 cycles if the amplitude is 20MPa, and the number of cycles to intermetallic failure is inversely proportional to the amplitude to a power of 9.

On the other hand, we also know that if the intermetallic bond did not fail before, then the joint would crack through the solder after 100 cycles at that amplitude, and the number of cycles to solder failure is inversely proportional to the amplitude to a power of 6.

Show a plot of the actual number of cycles to electrical failure vs cycling amplitude from 5 to 25 MPa.

Show the steps to be carried out in excel sheet and also final graph. The answer will be graded upon detailed explanation of each step.