m. m. r. howlader and f. zhang, void-free strong bonding of surface activated silicon wafers from room temperature to annealing at 600 ˚c, thin solid films 519 (2010) 804-808.

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Surface-activated silicon wafers were bonded firmly and void-free by MMR Howlader from room temperature to annealing at 600 °C, followed by analysis of the interface's optical, electrical, mechanical, and nanostructure properties.

What is annealing?

In the fields of metallurgy and materials science, annealing is a heat treatment that modifies the physical and occasionally chemical properties of a material to enhance its ductility and decrease its hardness, making it more workable.

Annealing is a heat-treatment procedure that modifies a material's physical, and occasionally chemical, properties to improve ductility and decrease hardness to make it more workable.

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